
WA_DEV_FEX20_PTS_004 Rev 001 June 30, 2010 42
Expansion Card Product Technical
Specification
Reliability Compliance and
Recommended Standards
6.3.2.6. Handling Resistance Stress Tests
The following tests the Fastrack Xtend’s resistance to handling malfunctions and damage.
Table 43: Handling Resistance Stress Tests
Special conditions:
Contact discharges: 10 positive and 10 negative applied
Voltage: ±2kV, ±4kV, ±6kV
Operating conditions: Powered
Operational Durability
OD
Special Conditions:
SIM Connector:
Cycles: 40
Repetition Rate: 3s per cycle
Objective: Mating and de-mating
System Connector:
Cycles: 40
Repetition Rate: 3s per cycle
Objective: Mating and de-mating
RF Connector:
Cycles: 20
Repetition Rate: 5s per cycle
Objective: Mating and de-mating
Operating conditions: Un-powered
Standard : IEC 60068-2-32, Test Ed
Special conditions:
Drop: 2 samples for each direction
Equivalent drop height: 1.5m
Number of directions: 6 (±X, ±Y, ±Z)
Number of drops/face: 2
Operating conditions: Un-powered
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